BONDexpo Stuttgart 2024

The BONDexpo Stuttgart trade fair is the international trade fair for bonding technology. Around 80 exhibitors will be presenting the current state of the art and the future of cost-effective bonding, joining and connection technology at BONDexpo Messe Stuttgart. With a clear and consistent focus on the process chain of joining and bonding by means of adhesive bonding, potting, sealing and foaming, the bonding technology trade show will offer economical detailed and system solutions for current and future challenges in the field of joining and bonding a wide variety of materials. The range of products and services includes raw materials for adhesives and sealants, machinery, equipment and accessories for the adhesive manufacturing and adhesive processing industry, adhesives and sealants, as well as sealing, testing and measuring technology. In addition, the extensive supporting program offers valuable information and best practices close to everyday industrial practice in the technical forum and various interesting lectures and workshops, and also provides ample opportunity to exchange information on current topics and products in production and assembly automation. BONDexpo Stuttgart runs parallel to Motek, the international trade fair for assembly, handling technology and automation.

• Messe Stuttgart (Landesmesse)
• Messepiazza 1
• 70629 Stuttgart

• Date: October 08. – 11. 2024
• Daily from 9:00 a.m. to 5:00 p.m.,
• Last day from 9:00 a.m. to 4:00 p.m

• Raw materials for adhesives and sealants, additives, fillers, colorants, curing agents, adhesion promoters, PUR dispersions, PUR adhesive raw materials, polymers, rheological additives, tackifiers, UV-curing raw materials, potting compounds, crosslinkers, machinery, equipment and accessories for the adhesives manufacturing industry, equipment for the production of hotmelt adhesives, filtration technology, laboratory machines, kneading units, mixing units, polyurethane adhesives (PUR), Epoxy adhesives (EP adhesives), Electronic adhesives, UV curing adhesives, Anaerobic curing adhesives, Cyanoacrylate adhesives, Hot melt adhesives, Plastisol adhesives, Transfer adhesives, 1-component adhesives, 2-component adhesives, reactive adhesives, pressure-sensitive adhesives, contact adhesives, dispersion adhesives, adhesives, die-cut parts, adhesive tapes, labels, machines, equipment and accessories for the adhesive and adhesive tape processing industry, dispensing equipment, mixing equipment, industrial robots for gluing and sealing, glue guns, squeeze guns, automatic spraying machines for the application of adhesives, hot-melt adhesive application systems, adhesive application systems, low-pressure potting technology, potting systems, UV sources, low-pressure plasma systems, atmospheric plasma systems, plasma systems, pre-treatment systems, cleaning systems, conveying systems, pumps, kneading systems, adhesive tape processing machines, consumables such as cartridges, needles, nozzles, cups or stirrers, machines, equipment, curing systems, sealing technology, testing technology, measuring technology, sealing technology materials, static + dynamic sealing system, semi-finished sealing products, profiles and molded parts (elastomer), sealing technology machines and equipment, tools and mold making, optical testing, materials testing, component testing, UV testing, services, contract filling, contract manufacturing, research and development, associations, publishers, further education, organizations.

• Will be published on our site at a later date

• First Event: 2007
• Exhibitor: 81
• Visitor: 34,725
• Exhibition Space: 3,000 sqm
• Exhibition Halls: 1

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